• DocumentCode
    3296573
  • Title

    Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability

  • Author

    Engin, A. Ege ; Toyota, Yoshitaka ; Kim, Tae Hong ; Swaminathan, Madhavan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2006
  • fDate
    9-12 May 2006
  • Firstpage
    79
  • Lastpage
    82
  • Abstract
    Simultaneous switching noise (SSN) is one of the major bottlenecks for successful design of high-performance systems. Especially mixed-signal designs are very sensitive to SSN due to the low voltage levels applied in analog circuits. One way of isolation is by placing the digital and analog domains far from each other. Even then, the power planes can transfer noise voltages both vertically and horizontally through out the board and total board area is a major concern in microminiaturized convergent systems. Electromagnetic bandgap structures (EBG) have been successfully applied for such isolation. Although any periodical shape can be used for isolation, only a few shapes have been reported, with various analysis methods. We present a new EBG with narrow slits, which shows a higher attenuation constant compared with existing structures. We also present a new analysis methodology for 2D EBG structures. Finally, a method to scale such EBG structures for different stopband requirements is introduced
  • Keywords
    analogue circuits; circuit noise; digital circuits; matrix algebra; network analysis; network synthesis; photonic band gap; 2D dispersion diagrams; EBG; SSN; analog circuits; digital circuits; electromagnetic bandgap; mixed-signal designs; power plane isolation; simultaneous switching noise; stopband requirements; Analog circuits; Attenuation; Circuit noise; Electromagnetic analysis; Low voltage; Metamaterials; Noise shaping; Periodic structures; Scalability; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2006. IEEE Workshop on
  • Conference_Location
    Berlin, Germany
  • Print_ISBN
    1-4244-0455-x
  • Electronic_ISBN
    1-4244-0455-x
  • Type

    conf

  • DOI
    10.1109/SPI.2006.289196
  • Filename
    4069411