Design, cost, size, and performance trade-offs of SOIC SMT technology vs. hybrid circuit technology

The requirements for amplification of very low level signals usually demands that the physical layout of the components be as compact as possible and that the circuit routing interconnect of the components be shielded so that any effects from external interference is minimized. The packaging implementation with these design constraints is the basis of the first trade-off question. Should packaged components be used to implement the design or should a hybrid be designed? This question is expanded further to include the evaluation of performance vs. size vs. cost as they apply to the specific design, the project size, and the expected life cycle of the project. All of these factors determine the packaging method and the final product configuration