High-Crosstalk Robustness Transmission Line Interconnect in Si LSI using Zero-Crosstalk Structure

Author

Kimura, Makoto ; Ito, Hiroyuki ; Sugita, Hideyuki ; Okada, Kenichi ; Masu, Kazuya

Author_Institution

Integrated Res. Inst., Tokyo Inst. of Technol., Yokohama

fYear

2006

fDate

9-12 May 2006

Firstpage

153

Lastpage

156

Abstract

This paper proposes a novel bus line structure using differential transmission lines, which equips high-density and high crosstalk-robustness. The feasibility of this structure is discussed from results of two-dimensional electromagnetic simulation and time-domain measurement. Measurement results show that the bus line has higher crosstalk robustness than that of the conventional co-planar line. The bus line can reduce effective density of 55% as compared with the conventional coplanar line

Keywords

crosstalk; elemental semiconductors; integrated circuit interconnections; large scale integration; silicon; transmission line theory; LSI; Si; bus line structure; differential transmission lines; high-crosstalk robustness transmission line interconnect; time-domain measurement; two-dimensional electromagnetic simulation; zero-crosstalk structure; Crosstalk; Delay; Distributed parameter circuits; Energy consumption; Integrated circuit interconnections; Large scale integration; Noise robustness; Power transmission lines; Transmission lines; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2006. IEEE Workshop on

Conference_Location

Berlin, Germany

Print_ISBN

1-4244-0455-x

Electronic_ISBN

1-4244-0455-x

Type

conf

DOI

10.1109/SPI.2006.289157

Filename

4069439