Interconnect Pitch for New Generation: Evolution due to Inductive Impact

Constant evolution in integrated circuits technology has led to an increase of the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Since global wires run on less dense upper metal layers increase wires separation allows reducing the coupling capacitance influence. However, with new technologies, the inductive coupling is not negligible, and don´t decrease at the same rate than the capacitive one, leading to an increase of the pitch to maintain the signal integrity