Title :
A breast molecular imaging hybrid pixel sensor test chip with low noise CMOS readout IC on fully depleted silicon-on-insulator design
Author :
Nguyen, D. ; Cormican, H. ; Baysal, A. ; Wiswall, C. ; Kerr, T. ; Wang, J.M. ; Ma, D.
Author_Institution :
Bioptics Inc., Tucson, AZ
Abstract :
This paper reports the design of an innovative CMOS active pixel sensor (CAPS) using Silicon-on-Insulator (SOI) technology. The CAPS designs approach provides the flexibility and high density features of hybrid pixel sensors with photon integration architecture. This sensor is the key component for the optimized biomarker scanner. A proof-of-principle test chip, paying particular attention to the noise performance of the pixel, the conversion gain, front-end electronics (FEE) and readout speed, can be available for testing in 2009. The overall objective of this paper is to contribute to improved diagnosis, prognosis, and prediction of breast cancer disease through the development of a very high conversion gain, low noise Photon Integration CMOS Imager. The design target for fluorescent detection limit with the CAPS is 4.49 fluorophores / mum2.
Keywords :
CMOS integrated circuits; biomedical optical imaging; cancer; patient diagnosis; readout electronics; silicon-on-insulator; CMOS active pixel sensor; breast cancer disease prediction; breast molecular imaging; conversion gain; front-end electronics; fully depleted silicon-on-insulator design; hybrid pixel sensor test chip; low noise CMOS readout IC; optimized biomarker scanner; patient diagnosis; photon integration architecture; prognosis; proof-of-principle test chip; readout speed; silicon-on-insulator technology; Breast; CMOS image sensors; CMOS integrated circuits; Electronic equipment testing; Hybrid integrated circuits; Integrated circuit noise; Integrated circuit testing; Molecular imaging; Pixel; Silicon on insulator technology;
Conference_Titel :
Complex Medical Engineering, 2009. CME. ICME International Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4244-3315-5
Electronic_ISBN :
978-1-4244-3316-2
DOI :
10.1109/ICCME.2009.4906588
