DocumentCode
3297403
Title
Modeling and Simulation of Highly Inductive On-Chip Interconnects
Author
Ligocka, A. ; Bandurski, W.
Author_Institution
Poznan Univ. of Technol.
fYear
2006
fDate
9-12 May 2006
Firstpage
235
Lastpage
238
Abstract
In the paper we present our approach to estimation of the transmission line step response. The main idea of the presented approach is to approximate the output signal of the lossy line, by analysis the behavior of the lossless transmission line. The output signal is expanded in the series of traveling waves. We construct the conditions when the first incident wave of lossless line is good approximation of the step response of the line
Keywords
VLSI; integrated circuit interconnections; transmission line theory; VLSI; highly inductive on-chip interconnects; lossless transmission line; lossy line; transmission line step response; traveling waves; Circuit simulation; Inductance; Integrated circuit interconnections; Laplace equations; Propagation losses; RLC circuits; Transmission line theory; Transmission lines; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location
Berlin, Germany
Print_ISBN
1-4244-0455-x
Electronic_ISBN
1-4244-0455-x
Type
conf
DOI
10.1109/SPI.2006.289231
Filename
4069466
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