DocumentCode :
3297656
Title :
High-Frequency Characterization of Printed CPW Lines on Textiles using a Custom Test Fixture
Author :
Wilson, J.M. ; Merritt, C.R. ; Karaguzel, B. ; Kang, T. ; Nagle, H.T. ; Grant, E. ; Pourdeyhemi, B. ; Franzon, P.D.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC
fYear :
2006
fDate :
9-12 May 2006
Firstpage :
279
Lastpage :
280
Abstract :
A screen printer is used to print conductive inks, loaded with silver particles, on nonwoven textiles substrates. To evaluate this technology for use as flexible interconnects; a custom test fixture was designed to assist in the high frequency characterization of CPW transmission lines. Due to the flexible nature of textile substrates it is necessary to have mechanical support at the points of electrical contact. However, the test fixture must not alter the electrical characteristics of the CPW lines. This test fixture removes the electrical effects of the mechanical support, and provides a simple and repeatable methodology for evaluating various types of textiles substrates, conductive inks, geometrical variations, and other parameters. Time-domain reflectometry (TDR) is used to measure the characteristic impedance of samples across geometrical variations in the 10 cm long CPW lines. A comparison showing the effects of the measuring the samples using the test fixture to measuring the samples on a solid acrylic substrate, and a metal plate are presented
Keywords :
coplanar waveguides; electrical contacts; interconnections; materials testing; microstrip lines; silver; textiles; time-domain reflectometry; characteristic impedance; custom test fixture; electrical contact; geometrical variations; high-frequency characterization; mechanical support; metal plate; nonwoven textiles substrates; print conductive inks; printed CPW lines; silver particles; solid acrylic substrate; textiles; time-domain reflectometry; Contacts; Coplanar waveguides; Fixtures; Frequency; Ink; Printers; Silver; Testing; Textile technology; Transmission lines; RF and microwave testing; electronic textiles; polymer thick film; printed electronics; wearable electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location :
Berlin
Print_ISBN :
1-4244-0455-x
Electronic_ISBN :
1-4244-0455-x
Type :
conf
DOI :
10.1109/SPI.2006.289244
Filename :
4069479
Link To Document :
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