Title :
Impact of Broken High Frequency Signal Return Path on Signal Integrity
Author :
Winkel, T.-M. ; Frech, Roland ; Klink, Erich ; Kailer, Daniel ; Genovese, Edoardo
Author_Institution :
IBM Entwicklungs GmbH, Boblingen
Abstract :
Special test vehicles with and without broken high frequency signal return paths were built in order to measure their impact on signal integrity. Design guidelines for the transition between different packaging levels are derived and discussed
Keywords :
electronics packaging; broken high frequency signal return path; packaging levels; signal integrity; test vehicles; Area measurement; Capacitance measurement; Connectors; Electromagnetic fields; Frequency measurement; Packaging; Pins; Testing; Voltage; Wire;
Conference_Titel :
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location :
Berlin
Print_ISBN :
1-4244-0455-x
Electronic_ISBN :
1-4244-0455-x
DOI :
10.1109/SPI.2006.289246
