• DocumentCode
    3297688
  • Title

    Impact of Broken High Frequency Signal Return Path on Signal Integrity

  • Author

    Winkel, T.-M. ; Frech, Roland ; Klink, Erich ; Kailer, Daniel ; Genovese, Edoardo

  • Author_Institution
    IBM Entwicklungs GmbH, Boblingen
  • fYear
    2006
  • fDate
    9-12 May 2006
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    Special test vehicles with and without broken high frequency signal return paths were built in order to measure their impact on signal integrity. Design guidelines for the transition between different packaging levels are derived and discussed
  • Keywords
    electronics packaging; broken high frequency signal return path; packaging levels; signal integrity; test vehicles; Area measurement; Capacitance measurement; Connectors; Electromagnetic fields; Frequency measurement; Packaging; Pins; Testing; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2006. IEEE Workshop on
  • Conference_Location
    Berlin
  • Print_ISBN
    1-4244-0455-x
  • Electronic_ISBN
    1-4244-0455-x
  • Type

    conf

  • DOI
    10.1109/SPI.2006.289246
  • Filename
    4069481
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3297688