Title :
Numerical Simulation of the Effect of Crack on the Tensile Mechanical Properties of Graphene
Author :
Han Cong-cong ; He Peng-Fei ; Zheng Bai-lin
Author_Institution :
Inst. of Appl. Mech., Tongji Univ., Shanghai, China
fDate :
July 31 2012-Aug. 2 2012
Abstract :
Molecular dynamics (MD) method with Tersoff bond-order interatomic potential function is applied to study (1) the impact of the crack-length on the tensile mechanical properties of graphene, and (2) how the crack affects the temperature correlation of graphene. The results show that the increase of crack length significantly reduces the tensile strength and tensile strain, and have an effect on Young´s modulus. Meanwhile, the sensitivity of the tensile strength and tensile rate on temperature will be weakened by crack.
Keywords :
Young´s modulus; cracks; deformation; graphene; molecular dynamics method; potential energy functions; tensile strength; C; Tersoff bond-order interatomic potential function; Young´s modulus; crack length; graphene; molecular dynamics method; numerical simulation; tensile mechanical properties; tensile strain; tensile strength; Atomic layer deposition; Atomic measurements; Temperature; Temperature sensors; Tensile strain; crack; graphene; mechanical properties; molecular dynamics (MD); temperature;
Conference_Titel :
Digital Manufacturing and Automation (ICDMA), 2012 Third International Conference on
Conference_Location :
GuiLin
Print_ISBN :
978-1-4673-2217-1
DOI :
10.1109/ICDMA.2012.133
