Title :
On-wafer inductors in flip chip-type circumstances
Author :
Karjalainen, Päivi H. ; Kokko, Kati H. ; Heino, Pekka
Author_Institution :
Tampere Univ. of Technol., Inst. of Electron., Tampere, Finland
Abstract :
New electronics packages such as system-in-package demand high-quality, reliable components. Attached on-wafer components have an ambient distinct from that of their plain counterparts and the ambience itself can change the characteristics of the components. In this study, on-wafer inductors were exposed to mechanical stress of 248 MPa and underfill covering for on-wafer measurements. The inductors were found to be robust against the tested external circumstantial factors. The inductance and quality factor values remained unchanged. The characteristics of the inductors appeared to be affected much more strongly by the layout than by the external strands.
Keywords :
Q-factor; flip-chip devices; inductors; semiconductor device packaging; stress analysis; system-in-package; 248 mPa; external circumstantial factors; flip chip; mechanical stress; on-wafer inductors; quality factor; system-in-package; underfill covering; Flip chip; Inductors; Magnetic field measurement; Mechanical variables measurement; Packaging; Semiconductor device measurement; Silicon; Stress measurement; Testing; Thermal stresses;
Conference_Titel :
NORCHIP Conference, 2005. 23rd
Print_ISBN :
1-4244-0064-3
DOI :
10.1109/NORCHP.2005.1597004
