DocumentCode :
3299707
Title :
A Parallel Rendezvous Algorithm for Interpolation Between Multiple Grids
Author :
Plimpton, Steve ; Hendrickson, Bruce ; Stewart, James
Author_Institution :
Sandia National Labs
fYear :
1998
fDate :
07-13 Nov. 1998
Firstpage :
53
Lastpage :
53
Abstract :
A number of computational procedures employ multiple grids on which solutions are computed. For example, in multi-physics simulations a primary grid may be used to compute mechanical deformation of an object while a secondary grid is used for thermal conduction calculations. When modeling coupled thermo-mechanical effects, solution data must be interpolated back and forth between the grids each timestep. On a parallel machine, this grid transfer operation can be challenging if the two grids are decomposed to processors differently for reasons of computational efficiency. If the grids move or adapt separately, the complexity of the operation is compounded. In this paper we describe a grid transfer algorithm suitable for massively parallel codes which use multiple grids. It uses a rendezvous technique wherein a third decomposition is used to search for elements in one grid that contain nodal points of the other. This has the advantage of enabling the grid transfer to be load-balanced separately from the remainder of the computations. The algorithm has been implemented as an object-oriented tool for the multi-physics code SIERRA, currently under development at Sandia. Performance and scalability results for the grid transfer operation running on the Intel/Sandia TFLOPS supercomputer are presented.
Keywords :
Grid Transfer; Load-Balancing; Multi-Physics; Multigrid; Parallel Computing; Computational efficiency; Computational modeling; Deformable models; Grid computing; Interpolation; Object oriented modeling; Parallel machines; Scalability; Thermal conductivity; Thermomechanical processes; Grid Transfer; Load-Balancing; Multi-Physics; Multigrid; Parallel Computing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Supercomputing, 1998.SC98. IEEE/ACM Conference on
Print_ISBN :
0-8186-8707-X
Type :
conf
DOI :
10.1109/SC.1998.10032
Filename :
1437340
Link To Document :
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