DocumentCode :
3299776
Title :
Study of annealing condition of InSbN alloys fabricated by ion implantation
Author :
Chen, X.Z. ; Zhang, D.H. ; Wang, Y. ; Jin, Y.J. ; Li, J.H. ; Deng, F.X. ; Zhang, Sam
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. of Univ., Singapore, Singapore
fYear :
2010
fDate :
5-9 July 2010
Firstpage :
1
Lastpage :
4
Abstract :
InSbN alloys are the new narrow bandgap semiconductors capable of broadband and long wavelength infrared photodetection. This paper reports the annealing conditions on the properties and quality of InSbN alloys, fabricated by multi-step ion implantation. The InSbN samples were annealed at different annealing methods, temperatures, and periods of time. They were characterized by various techniques, such as x-ray photoelectron spectroscopy and x-ray diffraction. It is found that the low-temperature-long-time annealing was better for defects elimination, while high-temperature-short-time annealing made more nitrogen activated. With the experimental data, detailed bonding of nitrogen in the alloys and their effects on the quality and properties can be achieved.
Keywords :
X-ray diffraction; X-ray photoelectron spectra; annealing; antimony alloys; bonds (chemical); indium alloys; ion implantation; narrow band gap semiconductors; InSbN; InSbN alloys; X-ray diffraction; X-ray photoelectron spectroscopy; annealing condition; broadband infrared photodetection; defect elimination; ion implantation; long wavelength infrared photodetection; narrow bandgap semiconductors; nitrogen bonding; Atomic layer deposition; Furnaces; Ion implantation; Nitrogen; Photonic band gap; Plasma temperature; Rapid thermal annealing; Substrates; X-ray diffraction; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location :
Singapore
ISSN :
1946-1542
Print_ISBN :
978-1-4244-5596-6
Type :
conf
DOI :
10.1109/IPFA.2010.5532225
Filename :
5532225
Link To Document :
بازگشت