Title :
Failure analysis of die crack in lidless packages
Author :
Foo, F.J. ; Ong, M.C. ; Tay, M.Y.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
Abstract :
Form factor requires lidless IC packages and die crack is one potential failure for exposed silicon dies. FA techniques such as SEM, FIB, and LSM are used to characterize the cracks to identity where they occur. The results also revealed intrinsic flaws that reduce the fracture strength of the die, making the die susceptible to cracking.
Keywords :
cracks; failure analysis; integrated circuit packaging; FA techniques; FIB; SEM; die crack failure analysis; lidless IC packages; silicon dies; Assembly; Costs; Failure analysis; Flip chip; Integrated circuit packaging; Optical microscopy; Scanning electron microscopy; Silicon; Stress; Testing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5596-6
DOI :
10.1109/IPFA.2010.5532238
