DocumentCode :
3300847
Title :
Design of a Modular Housing Platform to accommodate the remanufacturing of multiple cellular telephone models
Author :
Seliger, Guenther ; Skerlos, Steven J. ; Basdere, Bahadir ; Zettl, Marco
Author_Institution :
Dept. of Assembly Technol. & Factory Manage., Tech. Univ. Berlin, Germany
fYear :
2003
fDate :
8-11 Dec. 2003
Firstpage :
243
Lastpage :
250
Abstract :
Concern over the negative environmental impacts associated with the production, use, and end-of-life (EoL) of cellular telephones is particularly high due to large production volumes and characteristically short time scales of technological and stylistic obsolescence. Landfilled or incinerated cellular telephones create the potential for release of heavy metals or halocarbons. While recycling of components other than batteries is still not a widespread activity, cellular telephone remanufacturing is becoming a reality. In fact, third party re-manufacturers of cellular telephones are already making significant profits from sales in emerging markets. The acquisition of OEM cosmetic parts, such as housings, is among the highest costs of the remanufacturing process, especially when considering the large number of different cell phone variants that re-manufacturers must be able to accommodate. To address this issue, the research described in this paper involves the design and prototyping of a Modular Housing Platform (MHP) for cellular telephones. The MHP has the capability to accommodate components from different cellphone models as a means of achieving cost savings and increased efficiency in the remanufacturing process.
Keywords :
cellular radio; consumer electronics; design for environment; electronics industry; packaging; product design; recycling; OEM cosmetic parts; cellular telephone production; heavy metals; modular housing platform; multiple cellular telephone models; product design; recycling; remanufacturing process; Consumer electronics; Electronics industry; Environmental factors; Land mobile radio cellular systems; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location :
Tokyo, Japan
Print_ISBN :
0-7803-8590-x
Type :
conf
DOI :
10.1109/ECODIM.2003.1322670
Filename :
1322670
Link To Document :
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