DocumentCode :
3301162
Title :
Signal Integrity and Interconnections Test on Technical Fabrics
Author :
Zambrano, Andreina ; Silva, José Machado da
Author_Institution :
INESC TEC (former INESC Porto), Porto, Portugal
fYear :
2012
fDate :
14-16 May 2012
Firstpage :
79
Lastpage :
84
Abstract :
The use of textile yarns as data transmission media enables the design of non-obtrusive well-fitting garments as wearable systems. However, textile conductive yarns show impedances higher than those presented by common metal conductors and these values can change with the textile condition and level of stretching, affecting the integrity of the transmitted signal. This work proposes a built-in self-test methodology to test textile yarn interconnections for conventional stuck-at, open and short faults, as well as to verify signal integrity. The test procedure being proposed relies on sampling to generate a digital signal that results from comparing the received signal with pre-defined voltage levels. The obtained signature allows to verify signal integrity parameters: VLmax, VHmin and rise and fall times. Simulation results confirm the validity of the methodology being proposed.
Keywords :
built-in self test; clothing; fabrics; fault diagnosis; integrated circuit interconnections; integrated circuit testing; logic circuits; logic testing; signal generators; textile fibres; yarn; VHmin parameter; VLmax parameter; built-in self-test methodology; data transmission media; digital signal generation; digital signal sampling; integrated circuit interconnection; metal conductor; nonobtrusive well-fitting garment; open fault; pre-defined voltage level; rise-fall time parameter; short fault; signal integrity; signal transmission; stretching level; stuck-at fault; technical fabric; textile conductive yarn interconnection; wearable system; Conductors; Data communication; Impedance; Integrated circuit interconnections; Testing; Yarn; Built-in self-test; Signal integrity; Technical textile;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW), 2012 18th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1925-6
Type :
conf
DOI :
10.1109/IMS3TW.2012.25
Filename :
6298721
Link To Document :
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