A sub 40-nm body thickness n-type FinFET

We experimentally demonstrate near-ideal subthreshold behavior of fully-depleted fin-style double-gate n-type MOSFETs and the best measured transconductance Gm-sat = 72 S/m (>400 S/m intrinsic) for sub-40 nm n-type FinFETs reported. This silicon nFET exhibits experimental ideality n = 1.13, in good agreement with the deviation from unity expected due only to source/drain coupling. These results comprise the best behavior for 100 nm-scale double-gate nFETs in terms of channel subthreshold characteristics and gate leakage observed experimentally to date. Hisamoto et al. (1989) introduced experimental results on doubld-gate silicon MOSFETs in which the channel is formed by etching single-crystal silicon to leave a vertical fin standing, forming a gate which wraps around the fin, with source and drain regions on the two ends of the fin. This basic idea was further refined to sub-50 nm n-type MOSFETs and then extended to sub-50 nm p-type MOSFETs. Using simplified fabrication techniques, we demonstrate improved behavior, from an intrinsic channel point of view, of the nFET work, using conventional CMOS integration on n-type FinFETs.