• DocumentCode
    3302270
  • Title

    Simulation tools for damping in high frequency resonators

  • Author

    Koyama, Tsuyoshi ; Bindel, David S. ; He, Wei ; Quévy, Emmanuel P. ; Govindjee, S. ; Demmel, James W. ; Howe, Roger T.

  • Author_Institution
    Dept. of Civil & Environ. Eng., California Univ., Berkeley, CA
  • fYear
    2005
  • fDate
    Oct. 30 2005-Nov. 3 2005
  • Abstract
    This paper presents the development of HiQLab, a simulation tool to compute the effect of damping in high frequency resonators. Existing simulation tools allow designers to compute resonant frequencies but few tools provide estimates of damping, which is crucial in evaluating the performance of such devices. In the current code, two damping mechanisms: thermoelastic damping and anchor loss, have been implemented. Thermoelastic damping results from irreversible heat flow due to mechanically-driven temperature gradients, while anchor loss occurs when high-frequency mechanical waves radiate away from the resonator and into the substrate. Our finite-element simulation tool discretizes PDE models of both phenomena, and evaluates the quality factor (Q), a measure of damping in the system, with specialized eigencomputations and model reduction techniques. The core functions of the tool are written in C++ for performance. Interfaces are in Lua and MATLAB, which give users access to powerful visualization and pre- and postprocessing capabilities
  • Keywords
    Q-factor; damping; finite element analysis; reduced order systems; resonators; software tools; HiQLab; PDE models; anchor loss damping; eigencomputations technique; finite-element simulation tool; high frequency resonators; irreversible heat flow; model reduction; quality factor; thermoelastic damping; Computational modeling; Damping; Finite element methods; Frequency estimation; Mathematical model; Power system modeling; Q factor; Resonant frequency; Temperature; Thermoelasticity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2005 IEEE
  • Conference_Location
    Irvine, CA
  • Print_ISBN
    0-7803-9056-3
  • Type

    conf

  • DOI
    10.1109/ICSENS.2005.1597708
  • Filename
    1597708