DocumentCode :
3302765
Title :
Modelling the solder and resource consumption in lead-free soldering
Author :
Deubzer, Otmar ; Meysel, Frederik ; Muñoz, Jesus Reyes
Author_Institution :
Technische Univ. Berlin, Germany
fYear :
2003
fDate :
8-11 Dec. 2003
Firstpage :
714
Lastpage :
720
Abstract :
The electronics industry is shifting towards lead-free soldering. However, lead-free soldering arises concern because of the consumption of scarce resources like silver. Tin does not receive much attention, but compared to lead is scarce as well and the recycling rates are contentious. Sustainability considerations require careful use of resources, especially of scarcer and non-renewable ones. A dynamic model will help to assess the current status and future development of solder consumption and the resulting resource consumption. The current status of solder consumption and recycling shows the resource consumption for metals in (lead-free) solders. The use of silver and of additional tin in lead-free solders should not endanger the supply security. However, interlinkage of silver, lead and tin in ores, as well as the forecasted strong market growth of electronics may have strong influences. The forecasted increasing market of electronics devices requires miniaturization and integration as well as proper recycling to save scarce resources. A tool for sustainability evaluation will help to properly align alloy selection, recycling and legal regulations for most sustainable implementation of lead-free interconnection technologies.
Keywords :
electronics industry; printed circuits; recycling; reflow soldering; silver alloys; solders; tin alloys; wave soldering; SnAg; electronics industry; forecasted market growth; lead free interconnection technology; lead free soldering; ores; recycling rates; resource consumption; silver; solder consumption; tin; Electronics industry; Environmental factors; Printed circuits; Silver alloys; Soldering; Tin alloys;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location :
Tokyo, Japan
Print_ISBN :
0-7803-8590-x
Type :
conf
DOI :
10.1109/ECODIM.2003.1322762
Filename :
1322762
Link To Document :
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