DocumentCode :
3302821
Title :
Embedded life-cycle information module for monitoring and identification of product use conditions
Author :
Middendorf, A. ; Griese, H. ; Grimm, W.M. ; Reichl, H.
Author_Institution :
Fraunhofer IZM, Berlin, Germany
fYear :
2003
fDate :
8-11 Dec. 2003
Firstpage :
733
Lastpage :
740
Abstract :
Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Further, it could improve design, market research and quality management. This paper describes modular concepts for life-cycle monitoring, identification of use conditions, reliability assessment and diagnosis. MEMS-based prototypes are discussed, which measure, identify, and record data strongly correlated with the degradation of a product during its use phase. They are designed to get embedded in various products. The product´s remaining life can be estimated during its use by dedicated algorithms implemented in the data processing unit. The recorded data can be retrieved either during the use stage or after product takeback.
Keywords :
data analysis; micromechanical devices; quality management; recycling; reliability; remaining life assessment; MEMS based prototypes; component reuse; data processing unit; embedded life cycle information module; life cycle identification; life cycle monitoring; market research; product recycling; product refurbishing; product service; product use conditions; quality management; reliability assessment; remaining lifetime estimation; Environmental factors; Microelectromechanical devices; Reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location :
Tokyo, Japan
Print_ISBN :
0-7803-8590-x
Type :
conf
DOI :
10.1109/ECODIM.2003.1322766
Filename :
1322766
Link To Document :
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