• DocumentCode
    3302969
  • Title

    Integrated micromachined millimeter wave patch antenna

  • Author

    Emhemmed, A.S. ; Elgaid, K. ; Lok, L.B.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Univ. of Glasgow, Glasgow
  • fYear
    2009
  • fDate
    2-4 March 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We have proposed 3-D micromachined elevated patch antenna for G-band (140 GHz to 220 GHz) applications. The antenna is consisted of coplanar waveguide (CPW) feed line, a feeding post, air-bridge, supporting posts, and elevated patch. The antenna topology effectively creates a low dielectric substrate and undesired substrate effects can be eliminated, since the antenna substrate is essentially air which the lowest possible dielectric constant. This will increase the radiation efficiency, gain, and the radiation bandwidth. The measurement result shows the bandwidth is about 7 GHz, from 170 GHz to 177 GHz with nearly constant broadside radiation pattern. Also, this work has demonstrated the capability of fabricating a high performance antenna design in a MMICs compatible process.
  • Keywords
    antenna feeds; antenna radiation patterns; coplanar waveguide components; microstrip antenna arrays; submillimetre wave antennas; topology; 3D micromachined elevated patch antenna; G-band applications; MMIC; air-bridge; antenna design; antenna substrate; antenna topology; broadside radiation pattern; coplanar waveguide feed line; dielectric constant; dielectric substrate; feeding post; frequency 140 GHz to 220 GHz; frequency 170 GHz to 177 GHz; frequency 7 GHz; integrated micromachined patch antenna; millimeter wave patch antenna; radiation bandwidth; radiation efficiency; supporting posts; Antenna feeds; Antenna measurements; Antenna radiation patterns; Bandwidth; Coplanar waveguides; Dielectric constant; Dielectric measurements; Dielectric substrates; Patch antennas; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antenna Technology, 2009. iWAT 2009. IEEE International Workshop on
  • Conference_Location
    Santa Monica, CA
  • Print_ISBN
    978-1-4244-4395-6
  • Electronic_ISBN
    978-1-4244-4396-3
  • Type

    conf

  • DOI
    10.1109/IWAT.2009.4906903
  • Filename
    4906903