Title :
Automatic ECG artifact removal in the real-time SEMG recording system
Author :
Yong Hu ; Kwok, James ; Tse, Jonathan
Author_Institution :
Dept. of Orthopaedics & Traumatology, Univ. of Hong Kong, Hong Kong, China
Abstract :
The contaminated electrocardiography (ECG) is a big problem in the surface electromyography (SEMG) signal detection and analysis. The objective of the current study is to propose and validate an algorithm for the automated feature cognition and identification for eliminating ECG artifact from the raw SEMG signals. The utilization of Independent Component Analysis (ICA) method is to decompose the raw SEMG signals into individual independent source components. After that, some of the independent source components with the characteristics of ECG artifact were detected by the automated identification algorithm and thereafter eliminated. The sensitivity and specificity of the algorithm for distinguishing ECG source components from independent source components are 100% and 99% respectively. The automated identification algorithm exhibits the prominent performance of recognition for ECG artifact and can be considered reliable and effective.
Keywords :
cognition; electrocardiography; electromyography; feature extraction; independent component analysis; medical signal detection; real-time systems; recording; ECG artifact; ECG artifact recognition performance; ICA method; SEMG signal analysis; SEMG signal detection; automated feature cognition; automated feature identification; automated identification algorithm; automatic ECG artifact removal; contaminated electrocardiography; independent ECG source components; independent component analysis method; real-time SEMG recording system; surface electromyography signal analysis; surface electromyography signal detection; Back; Electrocardiography; Electrodes; Electromyography; Muscles; Reliability; Transforms; electrocardiography; independent component analysis; low back muscle; surface electromyography;
Conference_Titel :
Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA), 2013 IEEE International Conference on
Conference_Location :
Milan
Print_ISBN :
978-1-4673-4701-3
DOI :
10.1109/CIVEMSA.2013.6617398