DocumentCode
3303080
Title
Very low cost gyroscopes
Author
Geen, John A.
Author_Institution
Analog Devices Inc., Cambridge, MA
fYear
2005
fDate
Oct. 30 2005-Nov. 3 2005
Abstract
This paper was invited as part of discussion on the extent to which gyroscope cost and performance are influenced by micromachining. The contribution here addresses a very low cost segment enabled by integrating mechanisms and electronics. The resulting IC´s are also packaged and tested with standard technology. The paper outlines some of the corresponding design challenges and the methods used to overcome them in a commercial process
Keywords
gyroscopes; integrated circuit packaging; micromachining; integrated circuit packaging; low cost gyroscopes; micromachining; Accelerometers; Consumer electronics; Costs; Electronics packaging; Gyroscopes; Micromachining; Micromechanical devices; Stability; Testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2005 IEEE
Conference_Location
Irvine, CA
Print_ISBN
0-7803-9056-3
Type
conf
DOI
10.1109/ICSENS.2005.1597754
Filename
1597754
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