Title :
Very low cost gyroscopes
Author_Institution :
Analog Devices Inc., Cambridge, MA
fDate :
Oct. 30 2005-Nov. 3 2005
Abstract :
This paper was invited as part of discussion on the extent to which gyroscope cost and performance are influenced by micromachining. The contribution here addresses a very low cost segment enabled by integrating mechanisms and electronics. The resulting IC´s are also packaged and tested with standard technology. The paper outlines some of the corresponding design challenges and the methods used to overcome them in a commercial process
Keywords :
gyroscopes; integrated circuit packaging; micromachining; integrated circuit packaging; low cost gyroscopes; micromachining; Accelerometers; Consumer electronics; Costs; Electronics packaging; Gyroscopes; Micromachining; Micromechanical devices; Stability; Testing; Vehicles;
Conference_Titel :
Sensors, 2005 IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-9056-3
DOI :
10.1109/ICSENS.2005.1597754
