• DocumentCode
    3303241
  • Title

    An accurate model of thin film SOI-MOSFET breakdown voltage

  • Author

    Chen, J. ; Assaderaghi, F. ; Wann, H.-J. ; Ko, P. ; Hu, C. ; Cheng, P. ; Solomon, R. ; Chan, T.-Y.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • fYear
    1991
  • fDate
    8-11 Dec. 1991
  • Firstpage
    671
  • Lastpage
    674
  • Abstract
    A quantitative model which relates the SOI (silicon-on-insulator) MOSFET breakdown voltage to key parameters such as channel length, SOI film thickness, and gate voltage is presented. The SOI breakdown is caused by electron impact ionization current produced near the drain which is subsequently amplified by a parasitic lateral bipolar transition. This model is based on analytic modeling, quasi-2-D simulation and experimental study of the maximum drain electric field in SOI, and a novel method for measuring the lateral BJT (bipolar junction transistor) current gain beta using GIDL (gate-induced drain leakage) current. It can accurately model the breakdown voltage within 0.2 V for different channel lengths, gate voltages, and SOI film thicknesses.<>
  • Keywords
    electric breakdown of solids; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; GIDL; SOI breakdown; SOI film thickness; SOI-MOSFET breakdown voltage; analytic modeling; channel length; current gain; electron impact ionization current; experimental study; gate voltage; gate-induced drain leakage; key parameters; lateral BJT; maximum drain electric field; model; parasitic lateral bipolar transition; quasi-2-D simulation; Analytical models; Breakdown voltage; Current measurement; Electric breakdown; Electrons; Impact ionization; MOSFET circuits; Semiconductor films; Silicon on insulator technology; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0243-5
  • Type

    conf

  • DOI
    10.1109/IEDM.1991.235333
  • Filename
    235333