• DocumentCode
    3303298
  • Title

    A T-gate overlapped LDD device with high circuit performance and high reliability

  • Author

    Kurimoto, K. ; Odanaka, S.

  • Author_Institution
    Matsushita Electric Ind. Co. Ltd., Osaka, Japan
  • fYear
    1991
  • fDate
    8-11 Dec. 1991
  • Firstpage
    541
  • Lastpage
    544
  • Abstract
    The authors describe a novel T-gate overlapped LDD (lightly doped drain) device having the thick gate-oxide above the LDD region. It is shown that the thick gate-oxide above the LDD region is effective in reducing the vertical electric field in the LDD region and gate-drain overlapped capacitance. The T-gate overlapped LDD structure provides low gate-induced drain leakage (GIDL) and high speed/low power dissipation. This device improves by 3.5 V the subbreakdown voltage induced by the GIDL. The 0.6- mu m T-gate overlapped LDD device provides almost the same hot-carrier resistance, and represents a circuit speed of 65 ps/stage at Vdd=3 V and 15% improvement in power dissipation when compared with the 0.6- mu m gate overlapped drain device.<>
  • Keywords
    capacitance; electric breakdown of solids; hot carriers; insulated gate field effect transistors; leakage currents; reliability; 0.6 micron; 3 V; 65 ps; T-gate overlapped LDD device; gate-drain overlapped capacitance; high reliability; high speed; hot-carrier resistance; lightly doped drain; low gate-induced drain leakage; low power dissipation; subbreakdown voltage; thick gate-oxide; vertical electric field; Capacitance; Circuit optimization; Electric resistance; Hot carriers; Ion implantation; MOSFETs; Oxidation; Power dissipation; Semiconductor device reliability; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0243-5
  • Type

    conf

  • DOI
    10.1109/IEDM.1991.235337
  • Filename
    235337