DocumentCode
3303638
Title
A surrounding isolation-merged plate electrode (SIMPLE) cell with checkered layout for 256 Mbit DRAMs and beyond
Author
Ozaki, T. ; Nitayama, A. ; Sunouchi, K. ; Takato, H. ; Takedai, S. ; Yagishita, A. ; Hieda, K. ; Horiguchi, F.
Author_Institution
Toshiba Corp., Kawasaki, Japan
fYear
1991
fDate
8-11 Dec. 1991
Firstpage
469
Lastpage
472
Abstract
The authors describe a novel cell structure called a surrounding isolation merged plate electrode (SIMPLE) cell. In this cell, close-packed silicon pillars are laid out checker-wise, and a thin isolation-merged plate electrode surrounds the pillars. This cell structure leads to cell area reduction to 50%, trench depth reduction to 50%, and planarization and process step reduction compared with the conventional trench type cell. Using the design rule of 64 Mbit DRAM (dynamic RAM) (0.35 mu m), the SIMPLE cell can achieve a cell area of 256 Mbit DRAM (0.5 mu m/sup 2/). The SIMPLE cell is an attractive candidate for 256 Mbit DRAMs and beyond.<>
Keywords
DRAM chips; leakage currents; 0.35 micron; 256 Mbit; 64 Mbit; SIMPLE cell; Si pillars; cell area reduction; checkered layout; dynamic RAM; leakage current suppression; process step reduction; surrounding isolation-merged plate electrode; trench depth reduction; Capacitors; Electrodes; Etching; Fabrication; Lithography; Oxidation; Planarization; Random access memory; Silicon; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-0243-5
Type
conf
DOI
10.1109/IEDM.1991.235354
Filename
235354
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