• DocumentCode
    3303644
  • Title

    Thermoelectric properties of Bi-Sb composite prepared by mechanical alloying method

  • Author

    Miyajima, Masafumi ; Takagi, Kenta ; Okamura, Hiroshi ; Lee, Gil Geun ; Noda, Yasuo ; Watanabe, Ryuzo

  • Author_Institution
    DAIKIN Ind., Tsukuba, Japan
  • fYear
    1996
  • fDate
    26-29 March 1996
  • Firstpage
    18
  • Lastpage
    21
  • Abstract
    To study the mechanical alloying process and the properties of thermoelectric semiconductor with fine dispersed ceramic particles, Bi-Sb alloys with addition of fine BN and ZrO/sub 2/ were prepared by mechanical alloying. The milled powders were sintered by hot pressing. The Bi/sub 92.5/Sb/sub 7.5/ solid solution with fine dispersion of BN and ZrO ceramic particles were successfully synthesized. The sintered composites show very fine microstructures in which average grain size are less than one micron. The thermal properties of composites were measured by laser flash method at room temperature. The electrical properties were measured by Van der Pauw method at room temperature and at 77 K. The BN addition has obtained larger reduction of thermal conductivity compared to ZrO/sub 2/. The thermal conductivity has been reduced to 20% of the reported value of Bi-Sb single crystal, which achieved with 10 vol% addition of BN.
  • Keywords
    antimony alloys; bismuth alloys; boron compounds; composite materials; grain size; hot pressing; mechanical alloying; sintering; thermal conductivity; thermoelectricity; zirconium compounds; 77 K; Bi-Sb composite; Bi/sub 92.5/Sb/sub 7.5/; Bi/sub 92.5/Sb/sub 7.5/-BN-ZrO/sub 2/; average grain size; fine dispersed ceramic particles; fine microstructures; hot pressing; mechanical alloying method; sintered; thermal conductivity; thermoelectric properties; thermoelectric semiconductor; Alloying; Bismuth; Ceramics; Mechanical factors; Powders; Pressing; Solids; Temperature; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1996., Fifteenth International Conference on
  • Conference_Location
    Pasadena, CA, USA
  • Print_ISBN
    0-7803-3221-0
  • Type

    conf

  • DOI
    10.1109/ICT.1996.553248
  • Filename
    553248