DocumentCode
3303644
Title
Thermoelectric properties of Bi-Sb composite prepared by mechanical alloying method
Author
Miyajima, Masafumi ; Takagi, Kenta ; Okamura, Hiroshi ; Lee, Gil Geun ; Noda, Yasuo ; Watanabe, Ryuzo
Author_Institution
DAIKIN Ind., Tsukuba, Japan
fYear
1996
fDate
26-29 March 1996
Firstpage
18
Lastpage
21
Abstract
To study the mechanical alloying process and the properties of thermoelectric semiconductor with fine dispersed ceramic particles, Bi-Sb alloys with addition of fine BN and ZrO/sub 2/ were prepared by mechanical alloying. The milled powders were sintered by hot pressing. The Bi/sub 92.5/Sb/sub 7.5/ solid solution with fine dispersion of BN and ZrO ceramic particles were successfully synthesized. The sintered composites show very fine microstructures in which average grain size are less than one micron. The thermal properties of composites were measured by laser flash method at room temperature. The electrical properties were measured by Van der Pauw method at room temperature and at 77 K. The BN addition has obtained larger reduction of thermal conductivity compared to ZrO/sub 2/. The thermal conductivity has been reduced to 20% of the reported value of Bi-Sb single crystal, which achieved with 10 vol% addition of BN.
Keywords
antimony alloys; bismuth alloys; boron compounds; composite materials; grain size; hot pressing; mechanical alloying; sintering; thermal conductivity; thermoelectricity; zirconium compounds; 77 K; Bi-Sb composite; Bi/sub 92.5/Sb/sub 7.5/; Bi/sub 92.5/Sb/sub 7.5/-BN-ZrO/sub 2/; average grain size; fine dispersed ceramic particles; fine microstructures; hot pressing; mechanical alloying method; sintered; thermal conductivity; thermoelectric properties; thermoelectric semiconductor; Alloying; Bismuth; Ceramics; Mechanical factors; Powders; Pressing; Solids; Temperature; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1996., Fifteenth International Conference on
Conference_Location
Pasadena, CA, USA
Print_ISBN
0-7803-3221-0
Type
conf
DOI
10.1109/ICT.1996.553248
Filename
553248
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