DocumentCode
3303659
Title
A complete procedure to model the thermal behavior of magnetic components
Author
Escribano, L.M. ; Prieto, R. ; Oliver, Jesus A. ; Cobos, J.A.
Author_Institution
Div. de Ingenieria Electronica, Univ. Politecnica de Madrid, Spain
fYear
2004
fDate
17-22 Oct. 2004
Firstpage
71
Lastpage
76
Abstract
This work presents a practical study about different thermal problems in magnetic components. The study is carried out according to the fundamentals, the state of the art and the most practical modeling approaches. The goal of this study is to show different modelling techniques that have been proposed and used to compute the maximum temperature rise of magnetic components (analytical, finite element analysis (FEA), measurements, etc) considering the different geometries and thermal distributions and what are the benefits of using these techniques for the magnetic designer. The scope of the new different approaches to model the thermal behaviour is shown using FEA and measurements from a practical point of view.
Keywords
finite element analysis; magnetic cores; magnetic leakage; magnetic materials; temperature measurement; FEA; finite element analysis; magnetic components; magnetic designer; temperature rise; thermal behavior; thermal distribution; Couplings; Distributed computing; Heat transfer; Magnetic analysis; Magnetic cores; Magnetic devices; Magnetic materials; Magnetic properties; Solid modeling; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Congress, 2004. CIEP 2004. 9th IEEE International
Print_ISBN
0-7803-8790-2
Type
conf
DOI
10.1109/CIEP.2004.1437549
Filename
1437549
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