• DocumentCode
    3303744
  • Title

    Single-mask SOI fabrication process for linear and angular piezoresistive accelerometers with on-chip reference resistors

  • Author

    Eklund, E. Jesper ; Shkel, Andrei M.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Irvine, CA
  • fYear
    2005
  • fDate
    Oct. 30 2005-Nov. 3 2005
  • Abstract
    Piezoresistive accelerometers usually require separate photomasks for the fabrication of the proof mass, suspension, lightly doped piezoresistors, and highly doped conductors. This paper introduces a fabrication process that defines all components simultaneously using a single mask. By dry-etching SOI wafers that have a specific resistivity, piezoresistors can be defined and isolated from each other without the pn-junction normally required in piezoresistive sensors. The conductors are designed to be much wider than the piezoresistors and a free-standing proof mass is obtained by selectively removing the buried silicon oxide layer. Furthermore, reference resistors that provide the second half of a Wheatstone bridge are included on the silicon chip, eliminating the need for external resistors. Both single-axis and angular accelerometers have been fabricated and linear output characteristics are demonstrated when the single-axis devices are subjected to acceleration
  • Keywords
    accelerometers; etching; masks; piezoresistive devices; silicon-on-insulator; SOI wafers; Wheatstone bridge; angular piezoresistive accelerometers; buried silicon oxide layer; dry-etching; highly doped conductors; lightly doped piezoresistors; linear piezoresistive accelerometers; on-chip reference resistors; photomasks; piezoresistive sensors; pn-junction; proof mass; single-mask SOI fabrication process; Acceleration; Accelerometers; Bridge circuits; Conductivity; Conductors; Fabrication; Piezoresistance; Piezoresistive devices; Resistors; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2005 IEEE
  • Conference_Location
    Irvine, CA
  • Print_ISBN
    0-7803-9056-3
  • Type

    conf

  • DOI
    10.1109/ICSENS.2005.1597784
  • Filename
    1597784