• DocumentCode
    3304132
  • Title

    Application of FLAC in Foundation Pit with Compound Soil Nailing Support

  • Author

    Wang, Janjun ; Cao, Jing ; Hu, Jingkui ; Liu, Haiming

  • Volume
    4
  • fYear
    2008
  • fDate
    18-20 Oct. 2008
  • Firstpage
    331
  • Lastpage
    336
  • Abstract
    The numerical analysis method has a high position in the geotechnical engineering field, the specialized finite different computer codes for geomechanics applications has an extensive application more. Currently, the compound soil nailing support for foundation fit have been more and more extensive adopted, but the existing theories and methods are not mature enough. The main characteristic and the design processes of this method are described in this paper. FLAC was employed to establish a model to simulate the foundation fit compound soil nailing support, the model simulates and analyzes the process of excavation discharge dynamically by the prestressed anchor-compound soil nailing support, through the numerical analysis, the distribution rules of horizontal displacement, vertical settlement, axial force and displacement of anchor and soil nailing, stress-strain of soil mass were obtained. The results of simulation were compared and analyzed with the actual results which were obtained by a practical engineering. The model established by FLAC could reflect mechanics and distortion characteristics of foundation fit. It is helpful to design and construction of the compound soil nailing support.
  • Keywords
    foundations; supports; FLAC; compound soil nailing; foundation pit; numerical analysis method; wall support; Analytical models; Application software; Computer applications; Concrete; Geology; Joining processes; Numerical analysis; Process design; Soil; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Natural Computation, 2008. ICNC '08. Fourth International Conference on
  • Conference_Location
    Jinan
  • Print_ISBN
    978-0-7695-3304-9
  • Type

    conf

  • DOI
    10.1109/ICNC.2008.515
  • Filename
    4667300