DocumentCode :
3304690
Title :
Thermal impedance measurement of a self-heating probe
Author :
Horn, Michael
Author_Institution :
Inst. for Meas. & Autom., Bundeswehr Univ., Munich
fYear :
2005
fDate :
Oct. 30 2005-Nov. 3 2005
Abstract :
In case of large temperature dependencies of the properties, due to sufficient high voltages and currents the power dissipation in electric devices causes ´virtual´ electrical impedances. The reason is the thermal impedance, which is determined by the inside structure and the environmental conditions. For many fields in solid-state circuit design and sensor applications, the actual value of the thermal impedance bears important information about the state of the device and its surroundings. In the paper it is shown, how the actual value of the thermal impedance can be determined directly from the continuously measured virtual electrical impedance
Keywords :
electric impedance measurement; network synthesis; probes; thermal analysis; self-heating probe; sensor applications; solid-state circuit design; thermal impedance measurement; Circuits; Current measurement; Electric resistance; Electric variables measurement; Frequency; Impedance measurement; Power measurement; Probes; Temperature sensors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2005 IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-9056-3
Type :
conf
DOI :
10.1109/ICSENS.2005.1597846
Filename :
1597846
Link To Document :
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