DocumentCode :
3304811
Title :
3.3 V BiNMOS technology using NPN transistors without buried layers
Author :
Shida, A. ; Kagamihara, M. ; Komatsu, M. ; Kumagai, K. ; Hirata, M.
Author_Institution :
NEC Corp., Kanagawa, Japan
fYear :
1991
fDate :
8-11 Dec. 1991
Firstpage :
93
Lastpage :
96
Abstract :
A VLSI technology suitable for low-voltage BiNMOS logic has been developed. A BiNMOS device structure, N substrate based emitter-followed CMOS (NECMOS), is proposed. NECMOS has a simple structure using a substrate NPN (S-NPN) transistor which does not need buried layers. This use of an N substrate and a thin epitaxial layer is capable of realizing low collector resistance for S-NPN. A polysilicon emitter type S-NPN transistor, with a maximum cutoff frequency of 9 GHz, has been integrated into a 0.8 mu m CMOS structure with three additional masks. The fan-out coefficient of the propagation delay time for a BiNMOS 2-NAND gate is 1/2.4 of that for a CMOS 2-NAND gate under 3.3 V operation.<>
Keywords :
BIMOS integrated circuits; VLSI; integrated circuit technology; 0.8 micron; 2-NAND gate; 3.3 V; 9 GHz; BiNMOS technology; LV logic; N substrate; NECMOS; NPN transistors; VLSI technology; emitter-followed CMOS; maximum cutoff frequency; n-p-n transistors; polysilicon emitter; thin epitaxial layer; BiCMOS integrated circuits; Boron; CMOS logic circuits; Epitaxial layers; Impurities; Large scale integration; Logic devices; National electric code; Substrates; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0243-5
Type :
conf
DOI :
10.1109/IEDM.1991.235416
Filename :
235416
Link To Document :
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