Design of compact RF components for low-cost high-performance wireless front-ends

Author

Zheng, G. ; Pinel, S. ; Lim, K. ; Li, R. ; Tentzeris, M. ; Papapolymerou, J. ; Laskar, J. ; Lenoir, B. ; Blondy, P. ; Baillargeat, D. ; Guillon, P.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2002

fDate

17-19 Aug. 2002

Firstpage

259

Lastpage

262

Abstract

This paper presents the design and fabrication of RF components for compact and low cost wireless radio front-end systems. The system-on-package (SOP) concept has been applied to the design of an integrated C-Band transceiver and results are presented for a high performance LTCC band-pass filter and a via-fed stacked cavity-backed patch antenna. Multi-layer organic packaging development is also reported for very high Q-factor inductors and embedded filters. In addition, simulations and experimental data for an RF-MEMS ´2bit × 2bit´ tuner and a micromachined filter demonstrate the benefits of the integration of micromachined structures.

Keywords

micromechanical devices; packaging; transceivers; LTCC bandpass filter; RF component; RF-MEMS tuner; embedded filter; high-Q inductor; integrated C-band transceiver; micromachined filter; multi-layer organic packaging; system-on-package; via-fed stacked cavity-backed patch antenna; wireless radio front-end system; Band pass filters; Costs; Fabrication; Inductors; Packaging; Patch antennas; Q factor; Radio frequency; Radiofrequency microelectromechanical systems; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002. 2002 3rd International Conference on

Print_ISBN

0-7803-7486-X

Type

conf

DOI

10.1109/ICMMT.2002.1187685

Filename

1187685