Title :
Design for 3D Integration and Applications
Author :
Franzon, Paul D. ; Davis, William Rhett ; Steer, Michael B. ; Hao, Hua ; Lipa, Steven ; Luniya, Sonali ; Mineo, Christopher ; Oh, Julie ; Sule, Ambirish ; Thorolfsson, Thor
Author_Institution :
North Carolina State Univ., Raleigh
fDate :
July 30 2007-Aug. 2 2007
Abstract :
3D stacking and integration can provide system advantages equivalent to up to two technology nodes of scaling. This paper explores application drivers and computer aided design (CAD) for 3D ICs.
Keywords :
circuit CAD; integrated circuit design; 3D integration circuits; 3D stacking; CAD; computer aided design; Application software; CMOS process; Computer applications; Costs; Design automation; Integrated circuit interconnections; Packaging; Paper technology; Stacking; Wire; 3D IC; CAD; VLSI;
Conference_Titel :
Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
1-4244-1448-2
Electronic_ISBN :
1-4244-1449-0
DOI :
10.1109/ISSSE.2007.4294463
