EMI Suppression and Switching Noise Mitigation in Packages and Boards using Electromagnetic Band Gap Structures

Author

Ramahi, O.M. ; Mohajer-Iravani, B. ; Qin, J. ; Shahparnia, S. ; Kamgaing, T.

Author_Institution

Waterloo Univ., Waterloo

fYear

2007

fDate

July 30 2007-Aug. 2 2007

Firstpage

271

Lastpage

274

Abstract

In this paper, we present some developments in the application of electromagnetic band gap (EBG) structures to the problem of switching noise and electromagnetic interference in printed circuit boards and packages. We highlight the effect of using planar EBG structures on signal integrity with special emphasis on the eye diagram. We show that the incorporation of high dielectric material in packages structure leads to effective miniaturization of EBG cells, thus leading to practical implementation of EBG structures in chip packages.

Keywords

dielectric materials; electromagnetic interference; integrated circuit noise; integrated optoelectronics; photonic band gap; printed circuits; EMI suppression; chip packages; dielectric material; electromagnetic band gap; electromagnetic interference; eye diagram; printed circuit boards; signal integrity; switching noise mitigation; Bridge circuits; Circuit noise; Dielectric materials; Electromagnetic interference; Electromagnetic measurements; Metamaterials; Packaging; Periodic structures; Printed circuits; Voltage; Signal integrity; electromagnetic interference; switching noise;

fLanguage

English

Publisher

ieee

Conference_Titel

Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

1-4244-1448-2

Electronic_ISBN

1-4244-1449-0

Type

conf

DOI

10.1109/ISSSE.2007.4294465

Filename

4294465