EMI Suppression and Switching Noise Mitigation in Packages and Boards using Electromagnetic Band Gap Structures

In this paper, we present some developments in the application of electromagnetic band gap (EBG) structures to the problem of switching noise and electromagnetic interference in printed circuit boards and packages. We highlight the effect of using planar EBG structures on signal integrity with special emphasis on the eye diagram. We show that the incorporation of high dielectric material in packages structure leads to effective miniaturization of EBG cells, thus leading to practical implementation of EBG structures in chip packages.