• DocumentCode
    3305201
  • Title

    Microneedles for transdermal delivery of macromolecules

  • Author

    McAllister, D.V. ; Kaushik, S. ; Patel, P.N. ; Mayberry, J.L. ; Allen, M.G. ; Prausnitz, M.R.

  • Author_Institution
    Sch. of Chem. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    2
  • fYear
    1999
  • fDate
    36434
  • Abstract
    Transdermal drug delivery is limited by the extraordinary barrier properties of the stratum corneum, the outer 10-15 μm of skin. Arrays of solid silicon microneedles inserted across the stratum corneum have been shown to painlessly disrupt this barrier and increase the permeability of skin to calcein up to four orders of magnitude. In this study microneedles delivered bovine serum albumin (BSA) and insulin across human epidermis in vitro at similarly increased levels. To develop better microneedles, arrays of hollow silicon and metal needles have also been fabricated using microfabrication techniques including deep reactive ion etching, micromolding, and electroplating. The hollow needles have been successfully inserted through human epidermis and have been shown to permit water to flow through their bores
  • Keywords
    drug delivery systems; electroplating; microfluidics; micromachining; moulding; skin; sputter etching; barrier properties; bovine serum albumin; calcein; deep reactive ion etching; electroplating; hollow needles; human epidermis in vitro; insulin; microfabrication; micromolding; microneedle arrays; skin permeability; solid silicon microneedles; stratum corneum; transdermal drug delivery; Bovine; Drug delivery; Epidermis; Humans; Insulin; Needles; Permeability; Silicon; Skin; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    [Engineering in Medicine and Biology, 1999. 21st Annual Conference and the 1999 Annual Fall Meetring of the Biomedical Engineering Society] BMES/EMBS Conference, 1999. Proceedings of the First Joint
  • Conference_Location
    Atlanta, GA
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5674-8
  • Type

    conf

  • DOI
    10.1109/IEMBS.1999.803991
  • Filename
    803991