DocumentCode :
3305247
Title :
Plasma spray forming as a novel production method for thermoelectric materials
Author :
Schilz, Jürgen ; Riffel, Michael ; Mathesius, Robert ; Schiller, Günter ; Henne, Rudolf ; Smith, Ronald W.
Author_Institution :
Inst. fur Werkstoff-Forschung, Deutsche Forschungsanstalt fur Luft- und Raumfahrt, Koln, Germany
fYear :
1996
fDate :
26-29 March 1996
Firstpage :
71
Lastpage :
74
Abstract :
To date the development of thermoelectric materials and technology has reached a level, that allows the fabrication of reliable generators. It now turns out that the main impediment on the way to large scale, commercial (terrestrial) applications is primarily not the comparable low efficiency of the devices, but the high investment costs, which are still on the order of several ten Dollars per Watt. Necessary conditions for cost reduction are the availability of (i) cheap, non-toxic materials in large quantities and (ii) processing methods which allow efficient production; preferably the formation of complete device structures within a single, automized manufacturing step. This paper introduces plasma spraying as a forming process with the potential to fulfil the above stated condition. The paper reports on first studies on the consolidation and characterization of iron disilicide (FeSi/sub 2/). It was found that plasma spray forming is applicable to produce dense materials with properties comparable to hot-pressed ones.
Keywords :
iron compounds; plasma arc spraying; plasma deposited coatings; semiconductor growth; semiconductor materials; semiconductor thin films; thermoelectric power; FeSi/sub 2/; cost reduction; plasma spray forming; thermoelectric materials; Costs; Fabrication; Impedance; Materials reliability; Plasma applications; Plasma materials processing; Plasma properties; Production; Thermal spraying; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 1996., Fifteenth International Conference on
Conference_Location :
Pasadena, CA, USA
Print_ISBN :
0-7803-3221-0
Type :
conf
DOI :
10.1109/ICT.1996.553259
Filename :
553259
Link To Document :
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