• DocumentCode
    3305336
  • Title

    Design of Costless and Adjustable Inductors Embedded in Array Packages

  • Author

    Chen, Nansen ; Lin, Hongchin

  • Author_Institution
    Nat. Chung-Hsing Univ., Taichung
  • fYear
    2007
  • fDate
    July 30 2007-Aug. 2 2007
  • Firstpage
    383
  • Lastpage
    386
  • Abstract
    High performance, costless and tunable embedded inductors for applications in system-in-package design are proposed. Square segmented spiral inductors in the chip pad area of the standard two-layer array packages provide multiple selections of adjustable inductances without penalty of signal routing density. The inductor performance was extracted using 3D electromagnetic field solvers and wideband circuit optimization. A 4 mm2 spiral inductor can be achieved for inductance selection from 1 nH through 12 nH. In this range, an inductor of 7.6 nH with maximum Q-factor 37 can be obtained and its performance is comparable to that of LTCC or MCM-D.
  • Keywords
    ball grid arrays; inductors; integrated circuit design; system-in-package; 3D electromagnetic field solvers; Q-factor; adjustable inductances; adjustable inductors; ball grid arrays; chip pad area; insertion loss; signal routing density; square segmented spiral inductors; system-in-package design; tunable embedded inductors; two-layer array packages; wideband circuit optimization; Bonding; Circuit optimization; Costs; Equivalent circuits; Inductance; Inductors; Packaging; Radio frequency; Spirals; Wideband; BGA; LTCC; MCM-D; Q-factor; adjustable inductor; insertion loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    1-4244-1448-2
  • Electronic_ISBN
    1-4244-1449-0
  • Type

    conf

  • DOI
    10.1109/ISSSE.2007.4294493
  • Filename
    4294493