DocumentCode :
3305336
Title :
Design of Costless and Adjustable Inductors Embedded in Array Packages
Author :
Chen, Nansen ; Lin, Hongchin
Author_Institution :
Nat. Chung-Hsing Univ., Taichung
fYear :
2007
fDate :
July 30 2007-Aug. 2 2007
Firstpage :
383
Lastpage :
386
Abstract :
High performance, costless and tunable embedded inductors for applications in system-in-package design are proposed. Square segmented spiral inductors in the chip pad area of the standard two-layer array packages provide multiple selections of adjustable inductances without penalty of signal routing density. The inductor performance was extracted using 3D electromagnetic field solvers and wideband circuit optimization. A 4 mm2 spiral inductor can be achieved for inductance selection from 1 nH through 12 nH. In this range, an inductor of 7.6 nH with maximum Q-factor 37 can be obtained and its performance is comparable to that of LTCC or MCM-D.
Keywords :
ball grid arrays; inductors; integrated circuit design; system-in-package; 3D electromagnetic field solvers; Q-factor; adjustable inductances; adjustable inductors; ball grid arrays; chip pad area; insertion loss; signal routing density; square segmented spiral inductors; system-in-package design; tunable embedded inductors; two-layer array packages; wideband circuit optimization; Bonding; Circuit optimization; Costs; Equivalent circuits; Inductance; Inductors; Packaging; Radio frequency; Spirals; Wideband; BGA; LTCC; MCM-D; Q-factor; adjustable inductor; insertion loss;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
1-4244-1448-2
Electronic_ISBN :
1-4244-1449-0
Type :
conf
DOI :
10.1109/ISSSE.2007.4294493
Filename :
4294493
Link To Document :
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