DocumentCode
3305833
Title
Silicon integrated injection logic operating above 350 degrees C
Author
Sunayama, T. ; Kawakami, H. ; Migitaka, M.
Author_Institution
Dept. of Inf. & Control Eng., Toyota Technol. Inst., Nagoya, Japan
fYear
1991
fDate
8-11 Dec. 1991
Firstpage
161
Lastpage
164
Abstract
In order to develop silicon ICs operating above 350 degrees C, an integrated injection logic (IlL) was chosen as an example. A novel structure for the IIL was designed through experimental and theoretical studies of pn junctions and transistors at high temperatures. The designed IIL was achieved by newly developed combined processes of ion implantation and low-temperature epitaxy. The developed IIL is fully operational from room temperature to 385 degrees C. The V/sub OH/ decreases with temperature at the rate of 1.8 mV/ degrees C and is about 215 mV at 370 degrees C. V/sub OL/ does the same at about 45 mV in a temperature range from 50 to 370 degrees C. The signal swing of a nine-stage ring oscillator is about 30 mV at 385 degrees C. The power delay product is 18 pJ/stage.<>
Keywords
bipolar integrated circuits; elemental semiconductors; integrated circuit technology; integrated injection logic; oscillators; silicon; 18 pJ; 30 to 385 C; I/sup 2/L; IIL; Si; high temperature electronics; integrated injection logic; ion implantation; low-temperature epitaxy; pn junctions; power delay product; ring oscillator; room temperature; semiconductors; signal swing; temperature range; threshold voltage; transistors; Control engineering; Epitaxial growth; Inverters; Leakage current; Logic; Low voltage; Silicon; Substrates; Temperature distribution; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-0243-5
Type
conf
DOI
10.1109/IEDM.1991.235476
Filename
235476
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