Abstract :
Advanced micro sensors for pressure, angular rate, ultrasonic imaging and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep RIE, isotropic XeF2 silicon etching performs precise micromachining. Par(alle1 electrode structures enable capacitive sensing and electrostatic actuation for force balancing servo and resonance. 2. Pressure sensor and resonant gyro fabricated using deep RIE and XeF2 etching.
