DocumentCode

330641

Title

A Piezoresistive Silicon Accelerometer Using Porous Silicon Micromachining And Flip Chip Bonding

Author

Sim, Jun-Hwan ; Lee, Jong-Hyun

Author_Institution

Kyungpook National University

fYear

1998

fDate

13-16 July 1998

Firstpage

73

Lastpage

74

Keywords

Acceleration; Accelerometers; Actuators; Bonding; Flip chip; Micromachining; Piezoresistance; Silicon; Solid state circuits; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology Conference, 1998 International

Conference_Location

Kyoungju, South Korea

Print_ISBN

4-930813-83-2

Type

conf

DOI

10.1109/IMNC.1998.729972

Filename

729972