Title :
A Piezoresistive Silicon Accelerometer Using Porous Silicon Micromachining And Flip Chip Bonding
Author :
Sim, Jun-Hwan ; Lee, Jong-Hyun
Author_Institution :
Kyungpook National University
Keywords :
Acceleration; Accelerometers; Actuators; Bonding; Flip chip; Micromachining; Piezoresistance; Silicon; Solid state circuits; Thermal resistance;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 1998 International
Conference_Location :
Kyoungju, South Korea
Print_ISBN :
4-930813-83-2
DOI :
10.1109/IMNC.1998.729972
