Title : 
Monitoring thickness change of the Dongkemadi Glacier on Qinghai-Tibetan Plateau using SRTM DEM and map-based topographic data
         
        
            Author : 
Xing, Qiang ; Li, Zhen ; Zhou, Jianmin
         
        
            Author_Institution : 
Key Lab. of Digital Earth, CAS, Beijing, China
         
        
        
        
        
        
            Abstract : 
In this paper we measured the long-term thickness change of the Dongkemadi Glacier(DG) on Tanggula Mountain, Qinghai-Tibetan Plateau, using the Shuttle Radar Topography Mission (SRTM) C-band data(2000) and a digital elevation model(DEM) generated from topographic map(1969). First we check the accuracy of SRTM DEM by comparison at 16 random independent points in surrounding non-glacier area below 5500m a.s.l., then we focus on an analysis of the glacier´s surface thickness change features and a validation of the results using GPS survey data (2007) and DEM(1969) in Xiao Dongkemadi Glacier(XDG). The result shows XDG decreased by an average of 6.15m, or 0.20 m a-1 between 1969 and 2000. We estimate the error of annual thickness change rate to be on the order of 5% compared to the result of field measurement while Da Dongkemadi Glacier(DDG) decreased by an average of 20.74m or 0.67m a-1(1969-2000).
         
        
            Keywords : 
Global Positioning System; digital elevation models; glaciology; hydrological techniques; remote sensing by radar; topography (Earth); AD 1969 to 2000; C-band data; China; Da Dongkemadi Glacier; Dongkemadi Glacier; GPS survey data; Qinghai-Tibetan Plateau; Shuttle Radar Topography Mission; Tanggula Mountain; Xiao Dongkemadi Glacier; digital elevation model; map-based topographic data; thickness change rate; Accuracy; Earth; Global Positioning System; Monitoring; Remote sensing; Satellites; Thickness measurement; GPS; SRTM; digital elevation model; glacier; thickness change; topographic map;
         
        
        
        
            Conference_Titel : 
Geoscience and Remote Sensing Symposium (IGARSS), 2010 IEEE International
         
        
            Conference_Location : 
Honolulu, HI
         
        
        
            Print_ISBN : 
978-1-4244-9565-8
         
        
            Electronic_ISBN : 
2153-6996
         
        
        
            DOI : 
10.1109/IGARSS.2010.5649895