A robust MEMS probe card for fine pitch test using a new cantilever moving scheme

Author

Chung, Doo-Yun ; Kim, Bong-Hwan ; Chung, Chi-Hwan ; Park, Choon-Bae ; Lee, Jong-Ho ; Chun, Kukjin

Author_Institution

Dept. of Electr., Electron. & Inf. Eng., UniTest Inc., Chonbuk

fYear

2005

fDate

Oct. 30 2005-Nov. 3 2005

Abstract

A vertically guided MEMS probe card, designed to achieve a deflection of 50 mum at a force of 1.5 gram (g) and less than 50 mum of pad pitch, was developed. Based on our experimental results, the measured average contact resistance was approximately 0.2 ohm (Q at 1.44 g of force with leakage current approximately 10 pA between the tips and pads. In addition, tip planarity was about plusmn6 mum with x-y alignment errors within plusmn8 mum. A reliability test was performed, the average contact resistance was 0.4 Omega and the probe tip wear was less than 1 mum after the 10,000 time touchdowns. This newly proposed probe card is suitable for wafer-level testing and fine pitch device testing

Keywords

cantilevers; contact resistance; fine-pitch technology; leakage currents; micromechanical devices; test equipment; 10 pA; 50 micron; cantilever moving scheme; contact resistance; fine pitch test; leakage current; reliability test; robust MEMS probe card; Contact resistance; Current measurement; Electrical resistance measurement; Force measurement; Leakage current; Micromechanical devices; Probes; Q measurement; Robustness; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2005 IEEE

Conference_Location

Irvine, CA

Print_ISBN

0-7803-9056-3

Type

conf

DOI

10.1109/ICSENS.2005.1597964

Filename

1597964