• DocumentCode
    3307366
  • Title

    A high-voltage, doubly-strained In/sub 0.41/Al/sub 0.59/As/n/sup +/-In/sub 0.65/Ga/sub 0.35/As HFET

  • Author

    Bahl, S.R. ; Bennett, B.R. ; del Alamo, J.A.

  • Author_Institution
    MIT, Cambridge, MA, USA
  • fYear
    1992
  • fDate
    21-24 April 1992
  • Firstpage
    222
  • Lastpage
    225
  • Abstract
    An InAlAs/n/sup +/-InGaAs HFET (heterostructure field-effect transistor) on InP, suitable for power microwave applications, was designed and fabricated. A strained In/sub 0.65/Ga/sub 0.35/As channel is optimally doped to N/sub D/=6*10/sup 18/ cm/sup -3/. The heterostructure employs the following methodology to enhance device breakdown: (1) an ultrathin subchannel to introduce quantization and increase the effective channel bandgap, (2) a strained In/sub 0.41/Al/sub 0.59/As insulator, and (3) the elimination of parasitic mesasidewall gate-leakage. The resulting device (gate length=1.9 mu m, gate width=200 mu m) has a cutoff frequency=14.9 GHz, a maximum frequency of oscillation=101 GHz, breakdown voltage=12.8 V, and maximum drain current=302 mA/mm.<>
  • Keywords
    III-V semiconductors; aluminium compounds; energy gap; field effect transistors; gallium arsenide; indium compounds; power transistors; solid-state microwave devices; 1.9 micron; 101 GHz; 12.8 V; 14.9 GHz; 200 micron; HFET; In/sub 0.41/Al/sub 0.59/As-In/sub 0.65/Ga/sub 0.35/As-InP; device breakdown; effective channel bandgap; heterostructure field-effect transistor; high voltage doubly strained HFET; parasitic mesasidewall gate-leakage; power microwave applications; quantization; ultrathin subchannel; Breakdown voltage; Cutoff frequency; Electric breakdown; HEMTs; Indium compounds; Indium phosphide; Insulation; MODFETs; Photonic band gap; Quantization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1992., Fourth International Conference on
  • Conference_Location
    Newport, RI, USA
  • Print_ISBN
    0-7803-0522-1
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1992.235599
  • Filename
    235599