Analysis of the electro-thermal behaviour of multichip power modules

Author

Profumo, F. ; Tenconi, A. ; Facelli, S. ; Passerini, B.

Author_Institution

Dipt. di Ingegneria Elettrica Ind., Politecnico di Torino, Italy

Volume

2

fYear

1998

fDate

12-15 Oct. 1998

Firstpage

1031

Abstract

This paper presents an approach to the analysis of the electro-thermal behaviour of multichip power modules. A better understanding of thermal interactions among chips mounted inside the same package is important for the optimisation of the module design both in terms of performance and long term reliability. The analysis presented in this paper involves steady state, transient and fault conditions and is performed by means of both experimental measurements and simulations.

Keywords

AC-DC power convertors; bridge circuits; multichip modules; semiconductor device reliability; thermal analysis; thermal variables measurement; AC-DC bridge module; AC-DC three-phase module; chip temperature calculation; electro-thermal behaviour; fault conditions; long term reliability; module design; multichip power modules; overload conditions; performance; steady state conditions; thermal interactions; transient conditions; transient thermal impedance measurements; Bridge circuits; Circuit testing; Copper; Design optimization; Impedance; Leg; Multichip modules; Performance evaluation; Semiconductor device measurement; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE

Conference_Location

St. Louis, MO, USA

ISSN

0197-2618

Print_ISBN

0-7803-4943-1

Type

conf

DOI

10.1109/IAS.1998.730273

Filename

730273