Title :
Integrated micro heat sink for power multichip module
Author :
Gillot, C. ; Schaeffer, C. ; Bricard, A.
Author_Institution :
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Abstract :
Today, more and more compact converters with high current rates are required. The thermal environment is a key point to meet these requirements: the heat sink must be integrated as close as possible from heat sources. Liquid-cooled microchannel heat sinks are very efficient and well adapted to the cooling of power components. Thus, a high performance micro heat sink was made and tested under a power multichip module. First, the principle of the microchannel heat sink and a three-dimensional approach are presented. Then, the prototype and the results are described. Composed of eight IGBT chips, the prototype has a current rating as high as 1200 A.
Keywords :
heat sinks; insulated gate bipolar transistors; multichip modules; power bipolar transistors; power convertors; 1200 A; IGBT chips; current rating; heat sources; high current rates; high performance micro heat sink; integrated micro heat sink; liquid-cooled microchannel heat sinks; power converters; power multichip module; thermal environment; Cooling; Heat sinks; Heat transfer; Insulated gate bipolar transistors; Microchannel; Multichip modules; Prototypes; Resistance heating; Temperature; Thermal resistance;
Conference_Titel :
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location :
St. Louis, MO, USA
Print_ISBN :
0-7803-4943-1
DOI :
10.1109/IAS.1998.730275
