A parametric study of the design constraints and manufacturing tolerances for controlled impedance tape ball grid array designs

This paper investigates the design constraints and manufacturing tolerances necessary to achieve the performance objectives in tape ball grid array (TBGA) packaging necessary for integrated circuit (IC) devices requiring controlled impedance interconnections to the device output drivers. The emphasis of the paper is on correlation of electrical performance parameters that are critical to the operation of the TBGA package with the manufacturing tolerances and related process control strategies on physical product characteristics of the TBGA package. This is done by parametric analysis of the electrical parameters using electromagnetic extraction tools and then correlation of these parameters to manufacturing process control scenarios by statistical analysis and Monte Carlo process simulation. The study indicates strong interdependence between electrical performance and manufacturing tolerances and process control