Thermal management design criteria and solutions

Electronic packaging trends continue to increase power density while deploying smaller, more delicate components. In portable electronics, including notebook computers and cellular telephones, battery power is at a premium, making passive thermal management solutions preferable. This paper examines a new thermal management solution-a cost-effective, unique material which provides low thermal resistance with minimal stress on components. This paper also compares low thermal resistance at low applied pressure of the new material versus other conventional solutions