• DocumentCode
    3308770
  • Title

    A low thermal conductivity compound for thermoelectric applications: /spl beta/-Zn4Sb3

  • Author

    Caillat, T. ; Fleurial, Jean-Piem ; Borshchevsky, Alex

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    1996
  • fDate
    26-29 March 1996
  • Firstpage
    151
  • Lastpage
    154
  • Abstract
    The potential of the semiconducting compound /spl beta/-Zn/sub 4/Sb/sub 3/ for thermoelectric energy conversion was investigated. The thermoelectric properties were measured on hot-pressed samples characterized by X-ray and microprobe analysis. All samples had p-type conductivity and the thermoelectric properties of the samples were measured between room temperature and 400/spl deg/C. Exceptionally low thermal conductivity values were measured and the room temperature lattice thermal conductivity was estimated at 7 mW cm/sup -1/ K/sup -1/. High figures of merit were obtained between 200 and 400/spl deg/C and a maximum dimensionless thermoelectric figure of merit ZT of about 1.3 was obtained at a temperature of 400/spl deg/C. The stability of the compound was investigated by thermogravimetric studies and showed that the samples were stable under Ar atmosphere up to about 400/spl deg/C and up to 250/spl deg/C in dynamic vacuum. The high thermoelectric performance of /spl beta/-Zn/sub 4/Sb/sub 3/ in the 200 to 400/spl deg/C temperature range fills the gap established in the ZT spectrum of p-type state-of-the-art thermoelectric materials between Bi/sub 2/Te/sub 3/-based alloys and PbTe-based alloys. This material, relatively inexpensive, could be used in more efficient thermoelectric generators for waste heat recovery and automobile industry applications, for example.
  • Keywords
    Seebeck effect; electrical conductivity; hot pressing; semiconductor materials; thermal conductivity; thermoelectricity; zinc compounds; /spl beta/-Zn/sub 4/Sb/sub 3/; 23 to 400 degC; Ar atmosphere; X-ray analysis; Zn/sub 4/Sb/sub 3/; automobile industry applications; compound stability; dynamic vacuum; figures of merit; hot-pressed samples; lattice thermal conductivity; low thermal conductivity compound; microprobe analysis; p-type conductivity; semiconducting compound; thermoelectric applications; thermoelectric energy conversion; thermoelectric generators; thermoelectric properties; thermogravimetric studies; waste heat recovery; Automotive materials; Conductivity measurement; Energy conversion; Lattices; Semiconductivity; Temperature measurement; Thermal conductivity; Thermal stability; Thermoelectricity; Tin alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1996., Fifteenth International Conference on
  • Conference_Location
    Pasadena, CA, USA
  • Print_ISBN
    0-7803-3221-0
  • Type

    conf

  • DOI
    10.1109/ICT.1996.553280
  • Filename
    553280