Title :
Reliability analysis of embedded chip technique with design of experiment methods
Author :
Lu, Xiuzhen ; Chen, Liu ; Cheng, Zhaonian ; Liu, Johan
Author_Institution :
Key State Lab for New Displays & Syst. Integration, Shanghai Univ., China
Abstract :
This paper presents reliability and failure analysis of embedded components on the liquid crystalline substrate. First, a demonstration module for embedded technology is fabricated. Then it is put into thermal cycling to find out the most obvious failure. 3D FEM analysis is employed to investigate the failure mode. A design of experiment method is conducted to obtain the optimal structure of embedded chip components.
Keywords :
design of experiments; failure analysis; finite element analysis; multichip modules; 3D FEM analysis; design of experiment methods; embedded chip technique; failure analysis; liquid crystalline substrate; reliability analysis; thermal cycling; Design methodology; Electronics packaging; Failure analysis; Integrated circuit interconnections; Integrated circuit technology; Liquid crystal displays; Metallization; Power system reliability; Substrates; Testing;
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN :
1-4244-0107-0
DOI :
10.1109/EMAP.2005.1598233
