DocumentCode :
3308853
Title :
Effect of lead and cadmium free glasses on reliability of the silver end termination for MLCC application
Author :
Akhtar, Masyood
Author_Institution :
Lord Corp., Elverson, PA, USA
fYear :
2005
fDate :
11-14 Dec. 2005
Firstpage :
67
Lastpage :
73
Abstract :
New regulations to control and manage waste disposal European Union come out with regulation like WEES (Waste from Electrical and Electronics Equipment) and RoHS (regulation of hazardous substance) use in European Union. RoHS eliminate use of hazardous elements like lead, cadmium, chromium and others form electronic equipments used and manufactured in European countries. Metech Electronic a division of Lord Corporation has developed silver end termination, which meets the requirements imposed by RoHS. New silver end termination paste is based on glass, which is free of elements regulated as hazardous in nature. Effect of glass on different barium titanate body type is presented. Effect of glass on the properties like IR value of the terminated parts before and after steam test is discussed. Data are presented on different tests like highly accelerated life test (HALT), termination dimension, load humidity test etc. conducted during its development and is compared with the existing Metech leaded products as well as similar products available in market for same application is presented. Fired scanning electron microstructure for fired termination is also presented along with optical image showing continuity of nickel and tin plating.
Keywords :
ceramic capacitors; glass; hazardous materials; reliability; silver; MLCC application; accelerated life test; barium titanate body type; cadmium free glass; fired scanning electron microstructure; lead free glass; multilayer ceramic capacitors; nickel plating; silver end termination; tin plating; Cadmium; Chromium; Electronic equipment; Electronic equipment manufacture; Environmentally friendly manufacturing techniques; Glass; Life testing; Silver; Waste disposal; Waste management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN :
1-4244-0107-0
Type :
conf
DOI :
10.1109/EMAP.2005.1598237
Filename :
1598237
Link To Document :
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